Product Description
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Bostik SL C955 ADVANCED is a premium, two-part smoothing compound engineered to deliver superior performance with minimal subfloor preparation—reducing installation time and overall project costs.
With outstanding flow properties and excellent adhesion, the compound can be applied directly to a wide range of common substrates without the need for priming, even over challenging surfaces such as old adhesive residues, ceramic tiles, Bostik damp-proof membranes, flooring-grade plywood, and resin-based flooring. Its low shrinkage formulation ensures a stable, durable finish.
The product is moisture-resistant, making it suitable for application to damp subfloors prior to the installation of a damp proof membrane. It can be applied in depths ranging from 2mm up to 30mm in a single pour when bulked out with the appropriate aggregate.
Designed with speed and efficiency in mind, Bostik SL C955 ADVANCED is walkable in as little as two hours, with floor coverings ready to be installed in approximately four hours under optimal ambient conditions. It is fully compatible with waterborne underfloor heating systems and may also be used to encapsulate electric cable heating systems, offering maximum versatility for modern flooring projects.